DOW NAVY
Low-cost Mid-wave Infrared Focal-Plane Array (FPA) Fabrication through Direct-bond Interconnection
Low-cost Mid-wave Infrared Focal-Plane Array (FPA) Fabrication through Direct-bond Interconnection is a funding opportunity from DOW NAVY, closing January 6, 2027.
Overview
Electro-Optic and Infrared (EO/IR) sensors are used in a wide variety of applications, such as navigation, wide-area surveillance, and targeting. Operating in the visible and near-IR bands, EO sensors are available with small pixels and in large arrays at low cost, because the Si-detector wafer and Si-ROIC wafer can…